Installation
SMT

EKRA 4000 series Compact

• Print sizes up to 610x510 mm
• Easy to operate thanks to the SIMPLEX user interface
• The cycle time: 9.11 s + print
• Suitable for sizes up to 31 inch templates
• IPAG Jet dispensation glue
• Applied solder paste inspection 2.5D
• Accuracy in regards to process repeatability

Assembleon AX-301

• Capacity 33 000 – 66 000 SMD components per hour
• An advanced collision detection system
• Precisely defined pressure during pick and placement ( FORCE CONTROL)=no damage to components
• Min. component size – 0.4 x 0.2 mm (01005)
• Capacity can be increased according to need without interfering with the fixture lines: Capacity as required

Assembleon MG-1R

• Eight-headed pick and placement automatic machine
• Capacity up to 24 000 components per hour
• Controlled heads for accurate placement of components
• Precision of pick and placement 50 um of chip components, 30 um BGA
• Stations for automatic nozzle cleaning
• Automatic temperature feedback for expansion due to temperature control

SMT QuattroPeak

• 3 pre-heating zones
• 2 re-melting zones with 4 thermal modules (2 top and 2 bottom)
• Thermal profiles setting
• Reliable soldering of components with high heat dissipation
• Roller conveyor with center support (programmable speed)

DEK HORIZON 03iX

• 2D Optical quality control of paste application HawkEye 750
• Printable Area max. 600x508 mm
• Accuracy of 12.5 um (6 sigma)
• Templates already 29x29 inches
• Process-driven PC – LCD touch-screen with a menu in CZ/EN
• Programmable template cleaning
• 2D scanner

Yamaha YS24

• Sizes of PCB: min. length 50× width 50mm – max. length 700 x width 460mm
• Capacity: 72000 CPH
• Pick and placement accuracy:  ± 0.05 mm (? 3 +?) ± 0.03 mm (3?)
• Size of components: 0402 – 32 mm MAX
• Dispensers parts: for 120 types

Yamaha YG100R

• Eight-headed pick and placement automatic machine
• Capacity up to 24 000 parts per hour
• Controlled heads for exact positioning of components
• Precision pick and placement of 50 um of a chip component, BGA 30 um
• Mounts components 01005 – 100 x 45 mm
• Stations for automatic nozzle cleaning
• Automatic temperature feedback for expansion due to temperature control

Seho PowerReflow 2

• 6 pre-heating zones
• 3 reflow zones      
• Thermal profiles setting
• Total length 2735 mm
• Soldering in normal and nitrogen atmosphere
• Controlled active cooling
• Easy to use software

L3 DEK HORIZON 03iX

• 2D Optical quality control of paste application HawkEye 750
• Precision 12,5um (6 sigma)
• Templates already 29 x 29 inches
• Process-driven PC – LCD touch-screen with a menu in CZ/EN
• Programmable cleaning template
• 2D scanner

Assembleon MG-1R

• Eight-headed pick and placement automatic machine
• Capacity up to 24,000 components per hour
• Controlled heads for exact positioning of components
• Precision of pick and placement of 50 um of chip components, BGA 30 um
• Mounts components 01005 – 100 x 45 mm
• Stations for automatic nozzle cleaning

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SMT 2.8 TC

• 3 pre-heating zones
• 1 re-melting zone
• Thermal profiles setting
• Belt conveyor (programmable speed)

Washing equipment INJET CDR-388

• Fully automatic processes for washing, rinsing and drying – all in one chamber
• Frame, storage tubs, pipes, cladding – made completely out of stainless steel
• Complete PLC
• Automatic measurement of the quality of Di-water

Screen printing Autotronik SP 1200

• Automatic printing device with camera centering
• Centering repeatability +/- 0,01 mm
• The print area 1200x400 mm
• Vacuum table for PCB up to 1000 mm

Laser INSIGNIUM 3000

• Direct laser marking PCB
• Marking PCB to the dimensions of 508 x 508 mm
• Setting up PCB using the feed conveyor
• The servo-driven axis system